Booth number:W2-011 SEKISUI TECHNO MOLDING CO.,LTD

Exhibition category

main category 1 Space
sub category 1 Space related Material/Parts
main category 2 Aviation
sub category 2 Aircraft interior

Contact address

Address 2-10-4 Toranomon,Minato-ku,Tokyo 105-8566 JAPAN
Telephone +81367014696
Email masao.nagai@sekisui.com

Main exhibits 1

Heat conduction /Electromagnetic Wave Shielding Material Molding Product

Developed resin materials and molded products that can replace metal parts and housings (Aluminum, steel plate, etc.) used for heat conduction and electromagnetic wave Shielding countermeasures with plastic
Features
① Resin molded products with high electromagnetic wave shielding and heat conduction
② Realization of approximately 40% lighter weight than metal (Aluminum die casting, steel plate, etc.)
③ Proposal to reduce secondary processing costs and the number of parts by utilizing the degree of freedom of shape (resin conversion)
④ We provide the best products through consistent product manufacturing, from resin reforming to product design, manufacturing (injection molding), and quality control
We provide the best products

放熱・電磁波シールド(積水) (PDF file - 3,626KB)

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